PEM is a diamond backing pad with MONDRILLO technology for glue and epoxy removal. The diamond part is concentrated in very prominent segments to prevent residue from the removed material from impairing its use.

Available diameters: 115 – 125 mm.
Tool attachment: 22.2 mm diameter.
Materials: adhesive, glue, epoxy, sheathing, plasters and resins.
Use: dry and wet.
Equipment: angle grinder.

PERFORMANCE
Speed: Excellent.
Duration: Medium.